Coriant Hit 7070

Prolongue la vida de su Coriant Hit 7070 con los servicios de asistencia de expertos de Carritech: soluciones de confianza que mantienen su infraestructura heredada funcionando sin problemas y de forma rentable.

Sobre la Coriant Hit 7070

En Coriant HiT 7070 is a next-generation, carrier-class multi-service transport platform within the HiT 70xx series that integrates SDH, Ethernet switching, ATM, OTN, WDM, and ASON/GMPLS in a single compact chassis. Sharing hardware and software commonality with the widely deployed HiT 7080, the HiT 7070 simplifies operations, reduces deployment cost, and accelerates service delivery through streamlined service integration.

This flexible platform offers comprehensive SDH grooming, integrated packet switching, and Carrier Ethernet features for point-to-point, point-to-multipoint, and multipoint-to-multipoint configurations. It is particularly well-suited for service providers migrating from traditional SDH/MSPP networks toward resilient, packet-based transport for applications like mobile backhaul, Triple‑Play, and business services. Scalable and compact, the HiT 7070 supports services up to 10 Gbps and optional WDM integration, making it ideal for both metro and core aggregation deployments.

At Carritech, we offer complete support for the Coriant HiT 7070 family—including the HC variant—for global deployments. Our inventory of fully tested systems, spare cards, and modules enables network operators to maintain, repair, or extend HiT 7070 infrastructure efficiently. With expert technical support and fast delivery options, we help preserve legacy network investments while supporting gradual transitions to next-generation transport architectures.

Características principales del Coriant Hit 7070

  • Multi-Service Integration
    Combines SDH, Ethernet switching, ATM, OTN, WDM, and ASON/GMPLS functionalities in a single platform for versatile network deployment.

  • High Bandwidth Support
    Supports services up to 10 Gbps, including STM-1, STM-4, STM-16, and STM-64 interfaces, as well as Gigabit and 10 Gigabit Ethernet.

  • Advanced Ethernet Capabilities
    Offers Carrier Ethernet features including VLAN tagging, QoS, traffic shaping, multicast support, and Ethernet OAM for service assurance.

  • Flexible Network Topologies
    Supports point-to-point, point-to-multipoint, multipoint-to-multipoint configurations in ring, linear, hubbing, and mesh topologies.

  • Resilient Transport
    Integrated protection mechanisms such as SNCP, MSP, 2F-MS-SPRing, and RSTP provide sub-50ms failover and high availability.

  • Modular and Scalable Design
    Compact chassis with modular slots for interface cards, enabling flexible expansion and service upgrades.

  • WDM Integration
    Optional WDM capability enhances capacity and extends network reach in metro and core environments.

  • Operational Efficiency
    Shared hardware and software architecture with other HiT 70xx platforms streamlines maintenance and reduces training requirements.

  • Comprehensive Management
    Compatible with centralized network management systems supporting SNMP, CLI, and remote provisioning.

  • Carrier-Grade Reliability
    Designed for continuous operation with redundant power supplies, hot-swappable components, and robust fault management.

Información técnica

Platform Overview

  • Platform Type: Modular carrier-class Multi-Service Provisioning Platform

  • Primary Applications: Metro aggregation, business services, mobile backhaul, Triple-Play, and packet/legacy network convergence

  • Deployment Modes: Terminal multiplexer (TMX), add-drop multiplexer (ADM), local cross-connect (LXC), multi-ring terminal (MRT)

  • Supported Topologies: Ring, linear, hubbing, mesh, and multi-ring configurations

Switching Capacity

  • Cross-Connect Capacity:

    • Up to 10 Gbps per service

    • Non-blocking cross-connect fabric for high- and low-order SDH paths

  • Packet Switching: Layer 2 Ethernet switching with VLAN support and QoS features

Supported Interfaces

  • SDH Optical Interfaces:

    • STM-1 (OC-3), STM-4 (OC-12), STM-16 (OC-48), STM-64 (OC-192)

    • SFP and pluggable optics for flexible reach and wavelength selection

  • Electrical Interfaces:

    • E1/T1, DS3/E3

    • Fast Ethernet (10/100Base-T), Gigabit Ethernet (1000Base-T/X), 10 Gigabit Ethernet

  • Ethernet Features:

    • VLAN tagging (IEEE 802.1Q), traffic shaping, multicast, and Ethernet OAM (IEEE 802.1ag, Y.1731)

    • Carrier Ethernet service assurance and SLA support

Ethernet Over SDH and Packet Transport

  • Technologies Supported:

    • GFP (Generic Framing Procedure)

    • VCAT (Virtual Concatenation)

    • LCAS (Link Capacity Adjustment Scheme)

    • RPR (Resilient Packet Ring) support for Ethernet resilience

Protection and Reliability

  • SDH Protection:

    • SNCP (Sub-Network Connection Protection)

    • MSP (Multiplex Section Protection)

    • 2F-MS-SPRing (Two-fiber multiplex section shared protection ring)

  • Ethernet Protection:

    • RSTP (Rapid Spanning Tree Protocol) for Ethernet rings and mesh

  • Redundancy:

    • Dual control units and power supplies

    • Hot-swappable modules for minimal service disruption

Management and Operations

  • Management Interfaces:

    • CLI, SNMP, web-based interfaces

    • Integration with centralized NMS for provisioning, monitoring, and fault management

  • Alarms and Monitoring:

    • ITU-T G.826, G.828, G.829 compliant performance monitoring

    • Alarm generation with threshold-based alerts and diagnostics

Physical and Environmental

  • Form Factor: Modular chassis suitable for 19″ and ETSI racks

  • Refrigeración: Fan-cooled with monitored airflow

  • Fuente de alimentación: -48V DC, with redundant configurations supported

  • Operating Temperature: 0°C to +45°C (standard indoor telecom environment)

Propiedad e historia comercial

Periodo de tiempo Marca / Empresa Papel / Notas
Early 2010s – 2013 Nokia Siemens Networks (NSN) Launched as part of the hiT 70xx family, the HIT 7070 was designed for high-capacity aggregation and core transport in metro and regional optical networks.
2013 – 2018 Coriant Following acquisition of NSN’s optical division, Coriant promoted the HIT 7070 as a key component of its hybrid packet-optical transport portfolio.
2018 – Early 2020s Infinera Infinera acquired Coriant in 2018. Continued limited support for HIT 7070 while encouraging migration to Infinera’s modern transport platforms.
Presente (mercado secundario) Distribuidores independientes y especialistas en asistencia (por ejemplo, Carritech) Ongoing lifecycle extension and support offered by Carritech, including refurbished HIT 7070 units, modules and expert technical assistance for legacy networks.

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