Infinera XTC-10

The Infinera XTC-10 is a high-capacity optical transport platform engineered for scalability, efficiency, and intelligent service delivery across metro, regional, and long-haul networks. Built on Infinera’s unique photonic integrated circuit (PIC) technology, the XTC-10 delivers outstanding performance for carriers and data-driven enterprises seeking to maximize network capacity and flexibility.

As OEM support phases out following the product’s End-of-Life (EoL) notice, Carritech continues to provide comprehensive support for the XTC-10—ensuring your network remains fully operational and cost-effective well into the future. From spare parts and repairs to technical expertise and system maintenance, we offer a trusted alternative to OEM support, tailored specifically for legacy network environments.

Let Carritech help you extend the lifecycle of your Infinera XTC-10 infrastructure with confidence and continuity.

• Scalable Optical Transport
  Supports high-capacity service delivery across metro, regional, and long-haul networks with up to 5 Tbps of system capacity, scalable via modular expansion.

• Photonic Integrated Circuit (PIC) Technology
  Leverages Infinera’s innovative PIC technology to reduce power consumption, improve reliability, and simplify optical networking.

• Intelligent Transport Network (ITN) Architecture
  Designed with integrated control and management layers, enabling dynamic service provisioning and simplified operations.

• Multi-Service Support
  Delivers a range of services including Ethernet, OTN, SONET/SDH, and Fibre Channel across a unified optical layer.

• Seamless Integration & Interoperability
  Easily integrates with existing infrastructure and supports interoperability in multi-vendor environments.

• High Availability Design
  Redundant components and advanced protection mechanisms ensure carrier-grade reliability and uptime.

• Efficient Space & Power Utilization
  Compact footprint and energy-efficient design make it ideal for space-constrained network environments.

• Future-Proof Investment
  Modular architecture allows for cost-effective upgrades and network evolution without full hardware replacement.

System Overview

• Platform Type: Multi-terabit optical transport platform

• Chassis Height: 73.50 inches (1867.00 mm)

• Chassis Width: 19.44 inches (493.78 mm)

• Chassis Depth: 18.37 inches (466.60 mm)

• Rack Units: 42 RU

• Universal Slots: 10

• Maximum Capacity: Up to 12 Tbps

• Switching Fabric: Non-blocking OTN switching

Optical Capabilities

• Super-Channel Support: 500 Gbps to 2.4 Tbps per super-channel

• Modulation Formats: Supports BPSK, QPSK, 8QAM, 16QAM

• Photonic Integration: Utilizes Infinera’s Photonic Integrated Circuit (PIC) technology

• Sliceable Photonics: Allows tuning and routing of individual wavelengths within a super-channel

Client Interface Support

• Supported Interfaces: Ethernet (1G/10G/100G), OTN, SONET/SDH, Fibre Channel

• Tributary Interface Modules (TIMs): Modular design for various client interfaces

• Power Entry Module (PEM):

  • Height: 5.17 inches (131.32 mm)

  • Width: 3.15 inches (80.01 mm)

  • Depth: 16.87 inches (428.50 mm)

  • Weight: 13.0 lb (5.9 kg)

  • Power Feeds: Dual 60A DC inputs

• Cooling: Redundant fan trays with front-to-rear airflow

• Air Filter: 80% dust arrestance; recommended inspection every six months

Management and Control

• Control Modules: Redundant XTC Control Modules (XCMs)

• Timing Synchronization Modules (TSMs): Provide network timing and synchronization

• Management Interfaces: Supports SNMP, CLI, and web-based management

Compliance and Standards

• Regulatory Compliance: Designed to meet NEBS Level 3 and ETSI standards

• Environmental Specifications: Operates within standard telecom environmental ranges