Physical Specifications
Dimensions: 497 mm (W) × 295 mm (D) × 400 mm (H)
Service Board Slots: 17 slots per subrack
Power Consumption: Maximum of 1350 W per subrack
Operating Temperature: 5°C to 45°C (long-term), -5°C to 55°C (short-term)
Relative Humidity: 5% to 85%
Switching & Cross-Connect Capacity
Optical Switching: Supports 1 to 20-degree ROADM configurations
Electrical Switching: 180 Gbit/s for GE, 360 Gbit/s for 10GE/ODUk (k=1, 2, 2e)
Maximum Cross-Connect Capacity: 360 Gbit/s per subrack
Transmission & Wavelength Specifications
Supported Line Rates: 2.5 Gbit/s, 10 Gbit/s, 40 Gbit/s, and 100 Gbit/s
Maximum Rate per Channel: 100 Gbit/s (OTU4)
Wavelength Channels: Up to 80 channels (DWDM), up to 8 channels (CWDM)
Wavelength Range: 1529.16 nm to 1560.61 nm (DWDM, ITU-T G.694.1); 1471 nm to 1611 nm (CWDM, ITU-T G.694.2)
Supported Optical Modules: eSFP, SFP+, XFP, CFP
Service & Network Capabilities
Supported Services: SDH, SONET, Ethernet, SAN, OTN, Video
Network Topologies: Point-to-point, chain, star, ring, ring-with-chain, tangent ring, intersecting ring, mesh
Protection Mechanisms:
-
OTN: Optical line protection, intra-board 1+1 protection, client 1+1 protection, ODUk SNCP, tributary SNCP, SW SNCP, MS SNCP, ODUk SPRing protection, OWSP, board-level protection
-
Ethernet: DBPS, DLAG, ERPS, LAG, LPT, MSTP, STP, RSTP, VLAN SNCP
Equipment-Level Redundancy: Power supply, fan, cross-connect board, system control & communication board
Optical Power Management: ALS, AGC, ALC, APE, IPA, OPA
Synchronization Support: Synchronous Ethernet clock, IEEE 1588v2, 2 Mbit/s or 2 MHz (SSM, ITU-T G.703), external clock (1PPS+TOD)
ASON Support: Optical-layer ASON and electrical-layer ASON
Power & Environmental Specifications
Nominal Working Voltage: -48 V DC / -60 V DC
Maximum Subrack Power Consumption: 1350 W
Operating Temperature: 5°C to 45°C (long-term), -5°C to 55°C (short-term)
Relative Humidity: 5% to 85%